Postat 03 mai 2024
Procesor AMD Mobile Sempron 3400+ SMS3400HAX3CM
25 lei
Persoana fizica
Stare: Utilizat
Descriere
Procesor AMD Mobile Sempron 3400+ SMS3400HAX3CM
General information
Type CPU / Microprocessor
Market segment Mobile
Family
AMD Mobile Sempron
Model number 3400+
CPU part number
SMS3400HAX3CM is an OEM/tray microprocessor
Stepping codes ABBVF LEBAF LFBAF NEBAF NFBCF
Frequency 3400+ (rated)
1800 MHz (real)
Clock multiplier 9
Package 638-pin lidless micro-PGA
1.38" x 1.38" (3.5 cm x 3.5 cm)
AMD Package number 29249
Socket Socket S1 (S1g1)
Weight 0.2oz / 6.8g
Architecture / Microarchitecture
Microarchitecture K8
Processor core Keene
Core stepping F2
Manufacturing process 0.09 micron
Data width 64 bit
The number of CPU cores 1
The number of threads 1
Floating Point Unit Integrated
Level 1 cache size 64 KB 2-way set associative instruction cache
64 KB 2-way set associative data cache
Level 2 cache size 256 KB 16-way set associative cache
Multiprocessing Uniprocessor
Features
MMX instructions
Extensions to MMX
3DNow! technology
Extensions to 3DNow!
SSE / Streaming SIMD Extensions
SSE2 / Streaming SIMD Extensions 2
SSE3 / Streaming SIMD Extensions 3
AMD64 / AMD 64-bit technology
EVP / Enhanced Virus Protection
Low power features PowerNow! technology
Integrated peripherals / components
Integrated graphics None
Memory controller The number of controllers: 1
Memory channels: 2
Supported memory: DDR2
Other peripherals One 16-bit HyperTransport link with speeds up to 800 MHz
Electrical / Thermal parameters
V core 1.125V / 1.15V / 1.2V
Maximum operating temperature 95°C
Thermal Design Power 25 Watt
General information
Type CPU / Microprocessor
Market segment Mobile
Family
AMD Mobile Sempron
Model number 3400+
CPU part number
SMS3400HAX3CM is an OEM/tray microprocessor
Stepping codes ABBVF LEBAF LFBAF NEBAF NFBCF
Frequency 3400+ (rated)
1800 MHz (real)
Clock multiplier 9
Package 638-pin lidless micro-PGA
1.38" x 1.38" (3.5 cm x 3.5 cm)
AMD Package number 29249
Socket Socket S1 (S1g1)
Weight 0.2oz / 6.8g
Architecture / Microarchitecture
Microarchitecture K8
Processor core Keene
Core stepping F2
Manufacturing process 0.09 micron
Data width 64 bit
The number of CPU cores 1
The number of threads 1
Floating Point Unit Integrated
Level 1 cache size 64 KB 2-way set associative instruction cache
64 KB 2-way set associative data cache
Level 2 cache size 256 KB 16-way set associative cache
Multiprocessing Uniprocessor
Features
MMX instructions
Extensions to MMX
3DNow! technology
Extensions to 3DNow!
SSE / Streaming SIMD Extensions
SSE2 / Streaming SIMD Extensions 2
SSE3 / Streaming SIMD Extensions 3
AMD64 / AMD 64-bit technology
EVP / Enhanced Virus Protection
Low power features PowerNow! technology
Integrated peripherals / components
Integrated graphics None
Memory controller The number of controllers: 1
Memory channels: 2
Supported memory: DDR2
Other peripherals One 16-bit HyperTransport link with speeds up to 800 MHz
Electrical / Thermal parameters
V core 1.125V / 1.15V / 1.2V
Maximum operating temperature 95°C
Thermal Design Power 25 Watt
ID: 168040784
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