Postat 14 mai 2026
Memorie RAM Kingstone HyperX Beast DDR3-2400 8GB (2x4GB) CL 11
250 lei
Persoana fizica
Stare: Utilizat
Configuratie: Dual channel
Capacitate: 8 GB
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Descriere
Memorii RAM Kingston HyperX Beast DDR3
KHX24C11T3K2/8X 8GB (4GB 512M x 64-Bit x 2 pcs.) DDR3-2400 CL11 240-Pin DIMM Kit
DESCRIPTION
HyperX KHX24C11T3K2/8X is a kit of two 512M x 64-bit (4GB) DDR3-2400 CL11 SDRAM (Synchronous DRAM) 1Rx8 memory modules, based on eight 512M x 8-bit DDR3 FBGA components per module. Each module kit supports Intel XMP (Extreme Memory Profiles). Total kit capacity is 8GB. Each module kit has been tested to run at DDR3-2400 at a low latency timing of 11-13-13 at 1.65V. The SPDs are programmed to JEDEC standard latency DDR3-1333 timing of 9-9-9 at 1.5V. Each 240pin DIMM uses gold contact fingers and requires +1.5V. The JEDEC standard electrical and mechanical specifications are as follows:
XMP TIMING PARAMETERS
• JEDEC: DDR3-1333 CL9-9-9 1.5V
• XMP Profile #1: D3-2400 CL11-13-13 1.65V
• XMP Profile #2: D3-2133 CL11-12-11 1.6V
SPECIFICATIONS
CL(IDD): 9 cycles
Row Cycle Time (tRCmin): 49.5ns (min.)
Refresh to Active/Refresh: 260ns (min.)
Command Time (tRFCmin):
Row Active Time (tRASmin): 36ns (min.)
Maximum Operating Power: 2.100 W* (per module)
UL Rating: 94 V - 0
Operating Temperature: 0 C to 85 C
Storage Temperature: -55 C to +100 C
*Power will vary depending on the SDRAM used.
FEATURES
• JEDEC standard 1.5V (1.425V ~ 1.575V) Power Supply
• VDDQ = 1.5V (1.425V ~ 1.575V)
• 667MHz fCK for 1333Mb/sec/pin
• 8 independent internal bank
• Programmable CAS Latency: 9, 8, 7, 6
• Posted CAS
• Programmable Additive Latency: 0, CL - 2, or CL - 1 clock
• Programmable CAS Write Latency(CWL) = 7 (DDR3-1333)
• 8-bit pre-fetch
• Burst Length: 8 (Interleave without any limit, sequential with starting address “000” only), 4 with tCCD = 4 which does not allow seamless read or write [either on the fly using A12 or MRS]
• Bi-directional Differential Data Strobe
• Internal(self) calibration : Internal self calibration through ZQ pin (RZQ : 240 ohm ± 1%)
• On Die Termination using ODT pin
• Average Refresh Period 7.8us at lower than TCASE 85°C, 3.9us at 85°C TCASE 95°C
• Asynchronous Reset
• PCB : Height 1.827” (46.41mm) w/ heatsink, single sided component
KHX24C11T3K2/8X 8GB (4GB 512M x 64-Bit x 2 pcs.) DDR3-2400 CL11 240-Pin DIMM Kit
DESCRIPTION
HyperX KHX24C11T3K2/8X is a kit of two 512M x 64-bit (4GB) DDR3-2400 CL11 SDRAM (Synchronous DRAM) 1Rx8 memory modules, based on eight 512M x 8-bit DDR3 FBGA components per module. Each module kit supports Intel XMP (Extreme Memory Profiles). Total kit capacity is 8GB. Each module kit has been tested to run at DDR3-2400 at a low latency timing of 11-13-13 at 1.65V. The SPDs are programmed to JEDEC standard latency DDR3-1333 timing of 9-9-9 at 1.5V. Each 240pin DIMM uses gold contact fingers and requires +1.5V. The JEDEC standard electrical and mechanical specifications are as follows:
XMP TIMING PARAMETERS
• JEDEC: DDR3-1333 CL9-9-9 1.5V
• XMP Profile #1: D3-2400 CL11-13-13 1.65V
• XMP Profile #2: D3-2133 CL11-12-11 1.6V
SPECIFICATIONS
CL(IDD): 9 cycles
Row Cycle Time (tRCmin): 49.5ns (min.)
Refresh to Active/Refresh: 260ns (min.)
Command Time (tRFCmin):
Row Active Time (tRASmin): 36ns (min.)
Maximum Operating Power: 2.100 W* (per module)
UL Rating: 94 V - 0
Operating Temperature: 0 C to 85 C
Storage Temperature: -55 C to +100 C
*Power will vary depending on the SDRAM used.
FEATURES
• JEDEC standard 1.5V (1.425V ~ 1.575V) Power Supply
• VDDQ = 1.5V (1.425V ~ 1.575V)
• 667MHz fCK for 1333Mb/sec/pin
• 8 independent internal bank
• Programmable CAS Latency: 9, 8, 7, 6
• Posted CAS
• Programmable Additive Latency: 0, CL - 2, or CL - 1 clock
• Programmable CAS Write Latency(CWL) = 7 (DDR3-1333)
• 8-bit pre-fetch
• Burst Length: 8 (Interleave without any limit, sequential with starting address “000” only), 4 with tCCD = 4 which does not allow seamless read or write [either on the fly using A12 or MRS]
• Bi-directional Differential Data Strobe
• Internal(self) calibration : Internal self calibration through ZQ pin (RZQ : 240 ohm ± 1%)
• On Die Termination using ODT pin
• Average Refresh Period 7.8us at lower than TCASE 85°C, 3.9us at 85°C TCASE 95°C
• Asynchronous Reset
• PCB : Height 1.827” (46.41mm) w/ heatsink, single sided component
ID: 296483602
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