PS: HX432C16FB3K2/16 nu se mai fabrica si sunt greu de gasit asa ca este sansa ta sa iti faci upgrade de la 16GB la 32GB daca mai ai 2 module identice.
Memory Module Specifications

HX432C16FB3K2/16
16GB (8GB 1G x 64-Bit x 2 pcs.)
DDR4 3200 CL16 288 Pi DIMM Kit

SPECIFICATIONS
CL(IDD): 17 cycles
Row Cycle Time (tRCmin): 45.75ns(min.)
Refresh to Active/Refresh Command Time (tRFCmin): 350ns(min.)
Row Active Time (tRASmin): 32ns(min.)
UL Rating: 94 V - 0
Operating Temperature: 0 o C to +85 o C
Storage Temperature: -55 o C to +100o C

DESCRIPTION

HyperX HX432C16FB3K2/16 is a kit of two 1G x 64-bit (8GB)
DDR4-3200 CL16 SDRAM (Synchronous DRAM) 1Rx8, memory
module, based on eight 1G x 8-bit FBGA components per module.
Each module kit supports Intel® Extreme Memory Profiles (Intel®
XMP) 2.0. Total kit capacity is 16GB. Each module has been tested
to run at DDR4-3200 at a low latency timing of 16-18-18 at 1.35V.
The SPDs are programmed to JEDEC standard latency DDR4-2400
timing of 17-17-17 at 1.2V. Each 288-pin DIMM uses gold contact
fingers. The JEDEC standard electrical and mechanical
specifications are as follows:

FACTORY TIMING PARAMETERS
• Default (JEDEC): DDR4-2400 CL17-17-17 1.2V
• XMP Profile #1: DDR4-3200 CL16-18-18 1.35V
• XMP Profile #2: DDR4-3000 CL15-17-17 1.35V

FEATURES
• Power Supply: VDD = 1.2V Typical
• VDDQ = 1.2V Typical
• VPP = 2.5V Typical
• VDDSPD = 2.2V to 3.6V
• On-Die termination (ODT)
• 16 internal banks; 4 groups of 4 banks each
• Bi-Directional Differential Data Strobe
• 8 bit pre-fetch
• Burst Length (BL) switch on-the-fly BL8 or BC4(Burst Chop)
• Height 1.3425” (34.1mm), w/heatsink